DARPA is offering a grant for innovative R&D proposals in self-healing mixed-signal Integrated Circuits (ICs)/Systems-on-a-Chip (SoCs). The aim is to develop techniques to ensure fully operational mixed-signal SoCs that meet performance goals despite extreme process variations. The closing date for submission is May 19, 2009. For more information, refer to the BAA document attached to the BAA08-40 announcement. Queries can be directed to BAA08-40@darpa.mil.
Opportunity ID: 41735
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | DARPA-BAA-08-40 |
| Funding Opportunity Title: | Self-HEALing mixed-signal Integrated Circuits (HEALICs) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 3 |
| Posted Date: | May 21, 2008 |
| Last Updated Date: | Aug 06, 2008 |
| Original Closing Date for Applications: | May 19, 2009 Dates: Proposal Abstract Due Date and time –4:00 PM EST July 3, 2008 Proposal Due Date and time – 4:00 PM EST September 3, 2008 Proposer’s Day – June 19, 2008 |
| Current Closing Date for Applications: | May 19, 2009 Dates: Proposal Abstract Due Date and time –4:00 PM EST July 9, 2008 Proposal Due Date and time – 4:00 PM EST September 9, 2008 Proposer’s Day – June 19, 2008 |
| Archive Date: | Jun 22, 2009 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | $0 |
| Award Floor: | $0 |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | The purpose of this modification is to extend the due date of the Full proposals to 9 September 2008 and to add an attachment. See the attached conform BAA document. Original notice below.DARPA is soliciting innovative research and development (R&D) proposals in the area of self-healing mixed signal Integrated Circuits (ICs)/Systems-on-a-Chip (SoCs). The goal of the program is the development of techniques to maximize the number of fully operational mixed-signal SoCs on an individual wafer that meet all performance goals in the presence of extreme process variations and environmental conditions. See attached full BAA document. Submit your questions to BAA08-40@darpa.mil |
| Link to Additional Information: | MTO Solicitations Page |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Dr. Sanjay Raman
DARPA Program Manager Microsystems Technology Office 3701 North Fairfax Drive Arlington, VA 22203-1714 Fax: (703) 248-8062 Phone: (571) 218-4339 Email:BAA08-40@darpa.mil |
Version History
| Version | Modification Description | Updated Date |
|---|---|---|
| Aug 06, 2008 | ||
| Aug 06, 2008 | ||
| Jul 01, 2008 |
DISPLAYING: Synopsis 3
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | DARPA-BAA-08-40 |
| Funding Opportunity Title: | Self-HEALing mixed-signal Integrated Circuits (HEALICs) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 3 |
| Posted Date: | May 21, 2008 |
| Last Updated Date: | Aug 06, 2008 |
| Original Closing Date for Applications: | May 19, 2009 Dates: Proposal Abstract Due Date and time –4:00 PM EST July 3, 2008 Proposal Due Date and time – 4:00 PM EST September 3, 2008 Proposer’s Day – June 19, 2008 |
| Current Closing Date for Applications: | May 19, 2009 Dates: Proposal Abstract Due Date and time –4:00 PM EST July 9, 2008 Proposal Due Date and time – 4:00 PM EST September 9, 2008 Proposer’s Day – June 19, 2008 |
| Archive Date: | Jun 22, 2009 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | $0 |
| Award Floor: | $0 |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | The purpose of this modification is to extend the due date of the Full proposals to 9 September 2008 and to add an attachment. See the attached conform BAA document. Original notice below.DARPA is soliciting innovative research and development (R&D) proposals in the area of self-healing mixed signal Integrated Circuits (ICs)/Systems-on-a-Chip (SoCs). The goal of the program is the development of techniques to maximize the number of fully operational mixed-signal SoCs on an individual wafer that meet all performance goals in the presence of extreme process variations and environmental conditions. See attached full BAA document. Submit your questions to BAA08-40@darpa.mil |
| Link to Additional Information: | MTO Solicitations Page |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Dr. Sanjay Raman
DARPA Program Manager Microsystems Technology Office 3701 North Fairfax Drive Arlington, VA 22203-1714 Fax: (703) 248-8062 Phone: (571) 218-4339 Email:BAA08-40@darpa.mil |
DISPLAYING: Synopsis 2
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | DARPA-BAA-08-40 |
| Funding Opportunity Title: | Self-HEALing mixed-signal Integrated Circuits (HEALICs) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 2 |
| Posted Date: | Aug 06, 2008 |
| Last Updated Date: | – |
| Original Closing Date for Applications: | – |
| Current Closing Date for Applications: | May 19, 2009 Dates: Proposal Abstract Due Date and time –4:00 PM EST July 9, 2008 Proposal Due Date and time – 4:00 PM EST September 3, 2008 Proposer’s Day – June 19, 2008 |
| Archive Date: | Jun 22, 2009 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | $0 |
| Award Floor: | $0 |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | The purpose of this modification is to extend the due date of the Abstracts to 9 July 2008. See the attached conform BAA document. Original notice below.
DARPA is soliciting innovative research and development (R&D) proposals in the area of self-healing mixed signal Integrated Circuits (ICs)/Systems-on-a-Chip (SoCs). The goal of the program is the development of techniques to maximize the number of fully operational mixed-signal SoCs on an individual wafer that meet all performance goals in the presence of extreme process variations and environmental conditions. See attached full BAA document. Submit your questions to BAA08-40@darpa.mil |
| Link to Additional Information: | MTO Solicitations Page |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Dr. Sanjay Raman
DARPA Program Manager Microsystems Technology Office 3701 North Fairfax Drive Arlington, VA 22203-1714 Fax: (703) 248-8062 Phone: (571) 218-4339 Email:BAA08-40@darpa.mil |
DISPLAYING: Synopsis 1
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | DARPA-BAA-08-40 |
| Funding Opportunity Title: | Self-HEALing mixed-signal Integrated Circuits (HEALICs) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 1 |
| Posted Date: | Jul 01, 2008 |
| Last Updated Date: | – |
| Original Closing Date for Applications: | – |
| Current Closing Date for Applications: | May 19, 2009 Dates: Proposal Abstract Due Date and time –4:00 PM EST July 3, 2008 Proposal Due Date and time – 4:00 PM EST September 3, 2008 Proposer’s Day – June 19, 2008 |
| Archive Date: | Jun 22, 2009 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | $0 |
| Award Floor: | $0 |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | DARPA is soliciting innovative research and development (R&D) proposals in the area of self-healing mixed signal Integrated Circuits (ICs)/Systems-on-a-Chip (SoCs). The goal of the program is the development of techniques to maximize the number of fully operational mixed-signal SoCs on an individual wafer that meet all performance goals in the presence of extreme process variations and environmental conditions. See attached full BAA document. Submit your questions to BAA08-40@darpa.mil |
| Link to Additional Information: | MTO Solicitations Page |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Dr. Sanjay Raman
DARPA Program Manager Microsystems Technology Office 3701 North Fairfax Drive Arlington, VA 22203-1714 Fax: (703) 248-8062 Phone: (571) 218-4339 Email:BAA08-40@darpa.mil |
Related Documents
Folder 41735 Full Announcement-1 -> healics_baa08_40_mdb_4__21may08.pdf
Folder 41735 Full Announcement-1 -> HEALICs_BAA 08-40_Attachment 1_Penta Chart.pdf
Folder 41735 Full Announcement-2 -> healics_baa08_40_mod_01_finalforposting_1_july_08.pdf
Folder 41735 Full Announcement-3 -> HEALICs_BAA 08-40_Attachment2.pdf
Folder 41735 Full Announcement-3 -> healics_baa08_40_mod_02_final for posting_6_aug_08.pdf
Packages
| Agency Contact Information: | Dr. Sanjay Raman DARPA Program Manager Microsystems Technology Office 3701 North Fairfax Drive Arlington, VA 22203-1714 Fax: (703) 248-8062 Phone: (571) 218-4339 Email: BAA08-40@darpa.mil |
| Who Can Apply: | Organization Applicants |
| Assistance Listing Number | Competition ID | Competition Title | Opportunity Package ID | Opening Date | Closing Date | Actions |
|---|---|---|---|---|---|---|
| 12.910 | PKG00007305 | May 21, 2008 | May 19, 2009 | View |
Package 1
Mandatory forms
41735 RR_SF424-1.1.pdf
Optional forms
41735 RR_FedNonFedBudget-1.1.pdf
41735 RR_FedNonFed_SubawardBudget-1.2.pdf
41735 RR_PersonalData-1.1.pdf
41735 RR_OtherProjectInfo-1.1.pdf
41735 RR_Budget-1.1.pdf
41735 RR_KeyPersonExpanded-1.1.pdf
41735 RR_PerformanceSite-1.1.pdf
41735 RR_SubawardBudget-1.2.pdf
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