Opportunity ID: 41766
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | DARPA-BAA-08-42 |
| Funding Opportunity Title: | NanoThermal Interfaces (NTI) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 3 |
| Posted Date: | May 21, 2008 |
| Last Updated Date: | Aug 06, 2008 |
| Original Closing Date for Applications: | May 21, 2009 Dates: Abstract Due Date: 12:00 PM (noon) Eastern Time on June 10, 2008 Proposal Due Date: 12:00 PM (noon) Eastern Time on August 7, 2008 |
| Current Closing Date for Applications: | May 21, 2009 Dates: Abstract Due Date: 12:00 PM (noon) Eastern Time on June 10, 2008 Proposal Due Date: 12:00 PM (noon) Eastern Time on August 7, 2008 |
| Archive Date: | Jun 22, 2009 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | $0 |
| Award Floor: | $0 |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | This modification is an administrative amendment to revise Section V, “Application Review Information,” of the BAA. The following sentence is hereby removed from paragraph A “Evaluation Criteria”: “The above criteria are examples; (a), (b), (c), and (g) are required.”
Original description below. DARPA is soliciting innovative research proposals in the area of NanoThermal Interfaces (NTI). The primary goal of this program is the development and demonstration of ideas based on novel materials and structures that can provide significant reductions in the thermal resistance of the interface layer (often called the TIM) between the backside of an electronic device and the next layer of the package, which might be a spreader or a heatsink (this might be based on technologies developed in the DARPA-sponsored TGP and/or MACE programs, respectively). In addition to reductions in the thermal resistance of the TIM, DARPA is interested in practical considerations, such as reliability, the ability to rework the interface, and application at modest temperatures and in conventional environments. Additionally, DARPA is interested in concepts which can provide very high thermal conduction in the direction between the device and the spreader, while allowing shear due to differential thermal expansion between the device and spreader. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this BAA, should be directed to one of the administrative addresses below; e-mail is preferred. (BAA08-42@darpa.mil). See attached full BAA. |
| Link to Additional Information: | MTO Solicitations Page |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Dr. Thomas Kenny
DARPA/MTO 3701 North Fairfax Drive Arlington, VA 22203-1714 FAX: (703) 741-0079 PHONE: (703) 351-8479 Email:BAA08-42@darpa.mil |
Version History
| Version | Modification Description | Updated Date |
|---|---|---|
| Aug 06, 2008 | ||
| Aug 06, 2008 | ||
| May 22, 2008 |
DISPLAYING: Synopsis 3
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | DARPA-BAA-08-42 |
| Funding Opportunity Title: | NanoThermal Interfaces (NTI) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 3 |
| Posted Date: | May 21, 2008 |
| Last Updated Date: | Aug 06, 2008 |
| Original Closing Date for Applications: | May 21, 2009 Dates: Abstract Due Date: 12:00 PM (noon) Eastern Time on June 10, 2008 Proposal Due Date: 12:00 PM (noon) Eastern Time on August 7, 2008 |
| Current Closing Date for Applications: | May 21, 2009 Dates: Abstract Due Date: 12:00 PM (noon) Eastern Time on June 10, 2008 Proposal Due Date: 12:00 PM (noon) Eastern Time on August 7, 2008 |
| Archive Date: | Jun 22, 2009 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | $0 |
| Award Floor: | $0 |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | This modification is an administrative amendment to revise Section V, “Application Review Information,” of the BAA. The following sentence is hereby removed from paragraph A “Evaluation Criteria”: “The above criteria are examples; (a), (b), (c), and (g) are required.”
Original description below. DARPA is soliciting innovative research proposals in the area of NanoThermal Interfaces (NTI). The primary goal of this program is the development and demonstration of ideas based on novel materials and structures that can provide significant reductions in the thermal resistance of the interface layer (often called the TIM) between the backside of an electronic device and the next layer of the package, which might be a spreader or a heatsink (this might be based on technologies developed in the DARPA-sponsored TGP and/or MACE programs, respectively). In addition to reductions in the thermal resistance of the TIM, DARPA is interested in practical considerations, such as reliability, the ability to rework the interface, and application at modest temperatures and in conventional environments. Additionally, DARPA is interested in concepts which can provide very high thermal conduction in the direction between the device and the spreader, while allowing shear due to differential thermal expansion between the device and spreader. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this BAA, should be directed to one of the administrative addresses below; e-mail is preferred. (BAA08-42@darpa.mil). See attached full BAA. |
| Link to Additional Information: | MTO Solicitations Page |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Dr. Thomas Kenny
DARPA/MTO 3701 North Fairfax Drive Arlington, VA 22203-1714 FAX: (703) 741-0079 PHONE: (703) 351-8479 Email:BAA08-42@darpa.mil |
DISPLAYING: Synopsis 2
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | DARPA-BAA-08-42 |
| Funding Opportunity Title: | NanoThermal Interfaces (NTI) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 2 |
| Posted Date: | Aug 06, 2008 |
| Last Updated Date: | – |
| Original Closing Date for Applications: | – |
| Current Closing Date for Applications: | May 21, 2009 Dates: Abstract Due Date: 12:00 PM (noon) Eastern Time on June 10, 2008 Proposal Due Date: 12:00 PM (noon) Eastern Time on August 7, 2008 |
| Archive Date: | Jun 22, 2009 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | $0 |
| Award Floor: | $0 |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | This modification is an administrative amendment to correct the title of the full BAA document attached.
Original description below. DARPA is soliciting innovative research proposals in the area of NanoThermal Interfaces (NTI). The primary goal of this program is the development and demonstration of ideas based on novel materials and structures that can provide significant reductions in the thermal resistance of the interface layer (often called the TIM) between the backside of an electronic device and the next layer of the package, which might be a spreader or a heatsink (this might be based on technologies developed in the DARPA-sponsored TGP and/or MACE programs, respectively). In addition to reductions in the thermal resistance of the TIM, DARPA is interested in practical considerations, such as reliability, the ability to rework the interface, and application at modest temperatures and in conventional environments. Additionally, DARPA is interested in concepts which can provide very high thermal conduction in the direction between the device and the spreader, while allowing shear due to differential thermal expansion between the device and spreader. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this BAA, should be directed to one of the administrative addresses below; e-mail is preferred. (BAA08-42@darpa.mil). See attached full BAA. |
| Link to Additional Information: | MTO Solicitations Page |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Dr. Thomas Kenny
DARPA/MTO 3701 North Fairfax Drive Arlington, VA 22203-1714 FAX: (703) 741-0079 PHONE: (703) 351-8479 Email:BAA08-42@darpa.mil |
DISPLAYING: Synopsis 1
General Information
| Document Type: | Grants Notice |
| Funding Opportunity Number: | DARPA-BAA-08-42 |
| Funding Opportunity Title: | NanoThermal Interfaces (NTI) |
| Opportunity Category: | Discretionary |
| Opportunity Category Explanation: | – |
| Funding Instrument Type: | Cooperative Agreement Grant Other Procurement Contract |
| Category of Funding Activity: | Science and Technology and other Research and Development |
| Category Explanation: | – |
| Expected Number of Awards: | – |
| Assistance Listings: | 12.910 — Research and Technology Development |
| Cost Sharing or Matching Requirement: | No |
| Version: | Synopsis 1 |
| Posted Date: | May 22, 2008 |
| Last Updated Date: | – |
| Original Closing Date for Applications: | – |
| Current Closing Date for Applications: | May 21, 2009 Dates: Abstract Due Date: 12:00 PM (noon) Eastern Time on June 10, 2008 Proposal Due Date: 12:00 PM (noon) Eastern Time on August 7, 2008 |
| Archive Date: | Jun 22, 2009 |
| Estimated Total Program Funding: | – |
| Award Ceiling: | $0 |
| Award Floor: | $0 |
Eligibility
| Eligible Applicants: | Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility” |
| Additional Information on Eligibility: | – |
Additional Information
| Agency Name: | DARPA – Microsystems Technology Office |
| Description: | DARPA is soliciting innovative research proposals in the area of NanoThermal Interfaces (NTI). The primary goal of this program is the development and demonstration of ideas based on novel materials and structures that can provide significant reductions in the thermal resistance of the interface layer (often called the TIM) between the backside of an electronic device and the next layer of the package, which might be a spreader or a heatsink (this might be based on technologies developed in the DARPA-sponsored TGP and/or MACE programs, respectively). In addition to reductions in the thermal resistance of the TIM, DARPA is interested in practical considerations, such as reliability, the ability to rework the interface, and application at modest temperatures and in conventional environments. Additionally, DARPA is interested in concepts which can provide very high thermal conduction in the direction between the device and the spreader, while allowing shear due to differential thermal expansion between the device and spreader. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this BAA, should be directed to one of the administrative addresses below; e-mail is preferred. (BAA08-42@darpa.mil). See attached full BAA. |
| Link to Additional Information: | MTO Solicitations Page |
| Grantor Contact Information: | If you have difficulty accessing the full announcement electronically, please contact:
Dr. Thomas Kenny
DARPA/MTO 3701 North Fairfax Drive Arlington, VA 22203-1714 FAX: (703) 741-0079 PHONE: (703) 351-8479 Email:BAA08-42@darpa.mil |
Related Documents
Packages
| Agency Contact Information: | Dr. Thomas Kenny DARPA/MTO 3701 North Fairfax Drive Arlington, VA 22203-1714 FAX: (703) 741-0079 PHONE: (703) 351-8479 Email: BAA08-42@darpa.mil |
| Who Can Apply: | Organization Applicants |
| Assistance Listing Number | Competition ID | Competition Title | Opportunity Package ID | Opening Date | Closing Date | Actions |
|---|---|---|---|---|---|---|
| 12.910 | PKG00007340 | May 21, 2008 | May 19, 2009 | View |
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